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BGA Reballing [Presentation of technical materials for BGA reballing and rework]

We have numerous achievements in reballing and reworking "BGA with underfill," which is highly challenging in BGA reballing and rework! Technical materials featuring case studies are currently available!

Kei-Oll has numerous achievements in reballing and reworking with high-difficulty "BGA with underfill." Additionally, we can handle a wide range of micro sizes below 5×5mm and ball pitches from 1.27mm to 0.25mm, and we are capable of reballing for irregular and special pitch arrangements. We can assist in removing and reballing devices that are hard to obtain from other boards for implementation, especially when strict deadlines need to be met. 【Features】 ■ Two types of reballing technology (Capable of ball mounting using cream solder printing methods and dedicated flux application methods) ■ Supports micro-sized packages down to 5×5mm ■ Can accommodate changes in solder conditions (Composition changes from lead-free solder to eutectic solder are also possible) ■ Supports a wide range of pitches, including special pitches (Capable of handling ball pitches from 1.27mm to 0.25mm) *For details, please download the PDF or contact us.